Onto Innovation

05/21/2026

As advanced packaging architectures evolve to support larger, more complex devices, manufacturers are navigating increasing demands around scale, integration, and process control.

Onto Innovation’s advanced packaging portfolio—spanning panel- and wafer-level lithography, inspection, metrology, and manufacturing analytics—supports high-volume manufacturing requirements across heterogeneous integration, photonics, and emerging substrate technologies. By enabling integrated process control strategies, customers can improve yield and scale production for next-generation device architectures while achieving HVM throughput.

At the IEEE Electronic Components and Technology Conference (ECTC), the industry comes together to advance the future of semiconductor packaging. From May 27–28 in Orlando, the Onto team will be at Booth 107, engaging with customers on how these process control approaches address key challenges in advanced packaging manufacturing.

If you’re attending, connect with our team to discuss how we’re working with customers to advance packaging capability and manufacturing performance.

04/20/2026

Onto Innovation’s 2025 Environmental Social Governance Report is out, and we are proud to report we surpassed all our environmental targets. In 2025 we:

• Reduced our overall environmental impact by double digits.

• Lowered our carbon footprint per employee by 51%.

• Increased renewable energy usage to 44% of total electrical consumption.

At Onto Innovation, our mission is to help customers address the complex challenges of semiconductor manufacturing by improving yield, reducing material waste, and optimizing resource use. Throughout 2025, we continued to advance these goals while continuing to lower greenhouse gas emissions, reduce carbon footprint, and foster a diverse and inclusive workplace.

To read our 2025 ESG report in full, please visit: https://live-ontoinnovation-com.pantheonsite.io/wp-content/uploads/2026/04/Onto-ESG-Report-2025-final.pdf.

04/09/2026

April 12-16, semiconductor professionals will gather in Strasbourg to hear about the latest developments in optics and photonics technologies. Onto Innovation will be represented at the conference by Brice Chi, author of the poster presentation “Scalable AI-Driven Inspection for In-line Nuisance Filtering and Whole Wafer Pattern Classification.”

The poster details how automated optical inspection (AOI) is often burdened by high nuisance counts. These false alarms are caused by optical artifacts, background noise, and benign variations and often force legacy automatic defect classification (ADC) systems to trade detection sensitivity for manageable review volume, ultimately limiting throughput. To overcome this, Brice proposes using a unified ADC total solution integrating three specialized AI modules into a cohesive, data‑driven framework. Together, this total solution filters nuisances at the source while delivering holistic wafer-level insights for next-generation manufacturing.

To learn more about this cross-disciplinary event, please visit: https://spie.org/conferences-and-exhibitions/photonics-europe.

For more about Onto Innovation’s solutions for optical and photonics applications, please visit: https://ontoinnovation.com/.

03/18/2026

Organized alongside SEMICON China 2026, the Compound Semiconductor (CS) Asia Conference returns to Shanghai on March 24–26, bringing together industry leaders to discuss the rapid growth of SiC, GaN, and other power‑driving compound semiconductor technologies.

On March 26, make sure to attend Session 3: III‑V Compound Semiconductors, where Yu-Hsien (Jason) Lin of Onto Innovation will deliver his presentation A Multi‑Product Solution for SiC Substrate Defect Challenges.

As SiC continues to gain momentum in EVs, fast‑charging infrastructure, and high‑voltage applications, defect control at the substrate level has become one of the most critical bottlenecks to scaling. Jason will explore how Onto’s integrated portfolio, spanning advanced metrology, defect inspection, and analytical software technologies, works in combination to identify, classify, and reduce SiC substrate defects across the production workflow.

If you’re looking for insights into the world of compound semiconductors, Jason’s session is one you don’t want to miss.

See you in Shanghai!

For more on Onto Innovation portfolio of process control solutions, please visit: https://ontoinnovation.com/.

03/06/2026

SEMICON China 2026 is just a few weeks away, March 25-27, in Shanghai, China. The Onto Innovation team will be at Booth 5257 and ready to discuss Onto’s latest products supporting advanced packaging, silicon photonics, and power technologies.

On March 26, be sure to attend Session 3: III-V Compound Semiconductors, where Onto’s Jason Lin will present Enhancing Power Device Yield With 360° Defect Inspection.

To learn more about Onto, please visit: ontoinnovation.com.

For more on SEMICON China, please visit: semiconchina.org.

03/05/2026

Onto Innovation is a proud sponsor of the 2026 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics (FCMN), March 16-19, in Monterey, California.

FCMN brings together scientists and engineers to learn about the latest in characterization technology and the tools enabling them to solve the industry’s biggest challenges. Onto Innovation’s own Petar Žuvela will be a part of the discussion with the presentation of Spectrum-to-Structure Hybrid Metrology: SEM/TEM-Guided Machine Learning for 3D Reconstruction from X-ray Scattering Signals. The presentation is based upon work by the Device Solutions Division of Samsung Electronics Co., Ltd., Rigaku Corporation, and Onto.

To learn more about Onto Innovation’s comprehensive portfolio of process control solutions, including critical dimension metrology, thin films and material composition, defect inspection, machine-learning based analytic software, and the advanced packaging structures powering AI, please visit: https://lnkd.in/eWuWEgq8.

For more on FCMN, go to: https://fcmn2026.avs.org/.

03/02/2026

02/17/2026

The 2026 SPIE Advanced Lithography + Patterning conference and exhibition is right around the corner in San Jose, California, and the Onto Innovation team will be there at Booth 606. This year’s event also will feature a presentation by Onto Innovation’s Manjusha Mehendale on Buried Void Inspection in High Bandwidth Memory with Picosecond Laser Acoustics.

In the presentation Manjusha will discuss how Onto’s proprietary PULSE™ technology can enable manufacturers to detect voids created during the hybrid bonding process. While traditional non-destructive inspection methods struggle to detect sub-micron voids beneath silicon or metal layers, non‑contact, non‑destructive PULSE technology is capable of detecting high-resolution imaging of voids as small as 1µm, an important solution for one of hybrid bonding’s most significant challenges.

We encourage exhibition-goers to attend this informative presentation and reach out to the Onto Innovation team at Booth 606 for more on the company’s line of metrology, inspection, and enterprise software products.

To learn more, please visit: https://ontoinnovation.com/.

02/11/2026

SEMICON Korea is here, and you can find the Onto Innovation team at Booth D100. Stop by to learn more about our integrated solutions for next-generation memory and logic, advanced packaging, software, and factory analytics.

In addition, SEMICON Korea will feature a poster presentation from Onto’s Yu-Hsien (Jason) Lin, “High Sensitivity and Low Cost of Ownership Glass Carrier Inspection and UV Transmittance for Applications in Thinned Wafer Processing.”

We encourage exhibition-goers to view our poster and meet the Onto Innovation team at Booth D100 to discuss the company’s line of metrology, inspection, and enterprise software products.

To learn more about Onto, please visit our website: ontoinnovation.com.