10/26/2026
See it. Learn it. Bring it back to our customers.
That was the mission for the LINC Systems Packaging Team at PACK EXPO 2026 in Chicago.
Our team spent the week exploring new automation technologies, participating in private equipment training, discovering sustainable packaging solutions, and seeing firsthand where packaging technology is headed next.
From the Texwrap Versa X and Signode BXT-Go to the Wulftec ACE Carriage, Robopac ReConnect technology, robotics, sustainable solutions, and future engineers entering the industry, PACK EXPO offered an exciting look at what’s next.
Now we’re ready to turn what we learned into new ideas and opportunities for our customers.
🎥 Here’s a look back at our PACK EXPO experience!