10/07/2026
Spellman will exhibit at PACK EXPO International 2026, taking place October 18 - 21 at McCormick Place in Chicago, IL. Attendees are invited to visit Booth #7456 to explore Spellman's high-voltage and X-ray technologies developed for packaging and process control applications.
https://www.spellmanhv.com/en/About/Trade-Shows