Viking Technology

12/18/2025

In continuation of its ruggedized product line, Viking Technology expands its rugged product lineup with a Flash-based BGA SSD, engineered for high reliability in embedded, industrial, and military applications.

Designed to complement the DDR4 Multi Chip Package memory module, this new solution offers exceptional durability, wide temperature support, and a compact footprint ideal for space-constrained systems.

Built to perform under extreme conditions, the BGA SSD continues Viking’s commitment to providing rugged, high-performance storage for mission-critical environments.

Embedded, industrial, and military applications today are faced with many demands for enhanced data storage solutions that are efficient and reliable, capable of providing continuous operation in rugged environments, with high-density and space-saving features at the forefront of the design.

10/15/2025

Viking Technology is proud to share insights from our President, Hamid Shokrgozar, in Military Embedded Systems Magazine.

In this executive piece, Hamid discusses how our high-density DDR4 MCP memory solutions are designed to meet the FACE® Technical Standard, supporting modular, interoperable, and scalable defense systems.

Read it here (page 13):
🔗 https://militaryembedded.com/magazine/issuu/ey8qp3qvtxi

09/29/2025

As major suppliers phase out DDR4, Viking Technology continues full support, securing reliable DDR4 module availability so your systems remain uninterrupted.

Learn more ➥ https://www.vikingtechnology.com/ddr4-continued-support/

09/24/2025

Viking is proud to collaborate with Teledyne e2v on this exciting initiative. We look forward to the innovation and progress this partnership will bring.

🚀 Teledyne e2v Semiconductors expands access to high-performance memory solutions! We’re excited to announce a strategic distribution partnership with Viking Technology, focused on delivering its advanced storage products to a broader market in EMEA & APAC regions. This collaboration begins wit...

04/15/2025

📢 Exciting news! Viking's Principal Engineer, Brian Stark, will be presenting at CXL DEVCON 2025 in Santa Clara, CA! 🚀

Join Brian on Day 1, Track 2 from 3:30 - 3:50 pm as he discusses "Taking Advantage of the Existing IO Bus & Providing a Path for Memory Expansion."

Don't miss this opportunity to learn from our expert!

08/19/2024

Check out the exclusive interview with Viking's President, Hamid Shokrgozar, on SAE International, as he dives into the details of our latest innovation–the 16GB DDR4 Multi-Chip Package (MCP)–and its impact on the aerospace & defense industries.

https://www.nxtbook.com/smg/techbriefs/24ADT06/index.php #/p/4

08/15/2024

Viking's DDR5 memory modules offer enhanced capacity, reduced latency, and significantly faster data transfer rates.

See full specs & all form factors ➥ https://www.vikingtechnology.com/dram-modules/ddr5-memory/

08/08/2024

Wrapping up an incredible ! Grateful for the insights, connections, and innovations shared this week. Until next time!

08/07/2024

Stop by Viking's booth 521 to view our new CXL DDR4 NVDIMM memory module, featuring end-to-end robust data error containment & AHPC with checkpointing overhead reduction.

08/06/2024

Excited to kick off Day 1 of ! Ready to dive into the latest innovations and connect with industry leaders. Let’s make some memories!

07/31/2024

Join Viking August 6-8 for FMS: Future of Memory and Storage in Santa Clara – Booth 521. We're excited to reconnect with our partners, customers, and prospects. We will be showcasing our new CXL memory module. Make sure to stop by!

05/06/2024

This week’s product, Viking Technology’s Multi-Chip Package (MCP), is part of the company’s extreme density line of DDR4 memory products designed for the harsh environments of military and space applications such as military satellites and fighter jets.