Global Circuit Innovations, Inc.

Global Circuit Innovations, Inc. GCI’s team leverages decades of experience to generate innovative solutions for the most challenging electronics requirements.

We address the following markets and applications:

Engineering IC Obsolescence Solutions, High Temperature Environments, Hybrid Design, Failure Analysis, IC Assembly, R & D, and manufacturing Founded in 2006 in Colorado Springs, CO, GCI is an established Design & Manufacturing Engineering Solutions house for DoD electronic obsolescence and electronics in extreme environments. We address the follo

wing markets and applications:

Obsolescence – ICs and Circuit Card Assemblies (CCAs) solutions that address Diminishing Manufacturing Sources and Material Shortages (DMSMS) for defense, aerospace and industrial

Downhole – ICs and MCMs for “downhole” applications extending the IC survivability by >200X in high-temperature (>175C), high-mechanical shock environments

COTs Reliability

Hybrid Design and Manufacturing – Design engineering services to achieve higher levels of integration

Failure Analysis – World-class expertise in IC and system failure analysis

IC Assembly – Low volume to high volume Turnkey production capability

R&D and Engineering – Rapid prototyping, die and package thinning, die removal and reassembly, FPGA footprint remapping, counterfeit detection and Design Engineering expertise

Commitment to Quality Management - AS9100 and ISO 9001:2015 Certified

Address

4815 List Street, Suite 109
Colorado Springs, CO
80916

Opening Hours

Monday 8am - 5pm
Tuesday 8am - 5pm
Wednesday 8am - 5pm
Thursday 8am - 5pm
Friday 8am - 5pm

Telephone

+17195736777

Website

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Our Story

Global Circuit Innovations (GCI) specializes in extracting semiconductor die from ANY plastic or ceramic IC package (DER™ and DEER™ propriety technologies) , and then reassembling the “removed” die into an IC package of your choice including rugged, hermetic packages or Multi Chip Modules (MCMs) or making those die are available in “bare die” form. We address the following markets and applications: Obsolescence – ICs that address Diminishing Manufacturing Sources and Material Shortages (DMSMS) for DoD, aerospace and industrial/commercial. Downhole – ICs and MCMs for “downhole” applications extending the IC survivability by >200X in high-temperature (>175C), high-mechanical shock environments Hybrid Design and Manufacturing – Design engineering services to achieve higher levels of integration Failure Analysis – World-class expertise in IC and system failure analysis IC Assembly – Low volume to high volume Turnkey production capability R&D and Engineering – Rapid prototyping, die and package thinning, die removal and reassembly, FPGA footprint remapping, counterfeit detection and Design Engineering expertise Commitment to Quality Management - ISO 9001:20015 Certified