PGC - Progate Group Corporation

19/11/2025

🙌A quick reflection from TSMC OIP 2025, an event that continues to set the benchmark for ecosystem collaboration and advanced-node innovation!
At the OIP venue, we exchanged insights on AI-driven ASIC design, heterogeneous integration, STCO, and the growing importance of advanced packaging in next-generation compute systems.

As we continue the momentum, PGC is heading next to ICCAD Chengdu starting tomorrow.
We look forward to meeting partners across the ASIC, IP, and EDA ecosystem and sharing more on how PGC supports advanced-node design through our TSMC DCA-certified ASIC Turnkey Service.

Stay tuned for updates from Chengdu.🤩

18/11/2025

🚀 Every great ASIC starts with a prototype — but the real challenge is getting from first silicon to volume production fast.
With PGC’s CyberShuttle MPW service and TSMC’s advanced nodes (6 nm to 3 nm), we help customers validate designs early and move seamlessly into mass production.
Our turnkey flow integrates design, verification, tape-out and backend support — reducing risk and time-to-market for AI and HPC projects.
✔From prototype to product, we’re your one partner for first-silicon success.

14/11/2025

當系統已經無法再塞進單一顆晶片（die）時，該怎麼辦？

答案是——2.5D 與 3D 整合技術！
透過多顆晶片（dies）在共享的中介層（interposer）上以超短、高頻寬的通道互相連結，
不僅大幅提升資料吞吐量，也讓功耗更有效率。

PGC 結合 Synopsys 認證的 HBM4/PHY IP 與 TSMC 先進封裝技術（2.5D/3D），
協助客戶跨越記憶體頻寬瓶頸，實現下一代 AI 與 HPC 晶片的高速運算。

整合不只是「堆疊」，
而是讓運算、記憶體與訊號完整同步，成為一個真正的系統。

想了解我們如何突破這道瓶頸？
👉 前往了解更多https://pgc.pse.is/8cbchc

04/11/2025

📢 PGC is excited to participate in the TSMC OIP Ecosystem Forum 2025 on 11/18 at the Sheraton Hsinchu Hotel!

We’ll showcase our complete ASIC turnkey solutions to empower AI and HPC innovations using the latest 3/4/5/6 nm process nodes:
☑️integrating design
☑️IP
☑️advanced packaging
☑️production

Stop by to see how PGC collaborates within the TSMC ecosystem to turn ideas into silicon faster and smarter.

👉Check to learn more: https://bit.ly/47GnIsZ

31/10/2025

🚀 PGC is heading to Beijing for IC China 2025!
📆 Nov 23–25 | 📍 Booth B205 | Venue: CNCC, Beijing

At this key industry event, we’re presenting our one-stop ASIC turnkey solution — from design through to mass production. Together with our TSMC Design Center Alliance, we're committed to powering the next generation of AI & HPC chips.
Stop by booth B205 and chat with the PGC team about how we can accelerate your chip roadmap. See you in Beijing!
👉 Learn more: https://bit.ly/4o6rym7

29/10/2025

🎉 PGC is heading to ICCAD 2025!
We’re excited to join ICCAD 2025 — November 20–21, ChengDu, China — and meet innovators driving the future of advanced semiconductor design.
As a TSMC DCA member, PGC provides ASIC turnkey services covering 3–16 nm advanced nodes, enabling faster time-to-market and high reliability for AI and HPC applications.
Stay tuned for more from our ICCAD 2025 showcase!
📌Booth No.: G09
👉 Learn more: https://bit.ly/4nrXzUC

22/10/2025

Building a Greener Future, One Partnership at a Time 💚

Sustainability is more than a goal—it’s our responsibility.
Progate Group is proud to partner with E.SUN Financial Holding in the Sustainable Development Advocacy initiative, joining forces with leaders across industries to support Taiwan’s sustainable growth.
From nurturing green talent to implementing energy-efficient design and production, we continue to embed ESG values into every aspect of our innovation journey. Together, we believe that even the smallest chip can make a big difference for the planet. 🌏✨
💚 Learn more about our sustainability journey →https://pgc.pse.is/899tkz

14/10/2025

💡Breaking the “Memory Wall” — PGC Powers the AI Era with 2.5D/3D Integration!
As AI models become larger and more complex, the real performance bottleneck is no longer computing — it’s memory bandwidth.
PGC has combined the advanced 2.5D/3D packaging technologies with high-speed Chiplet interconnects to overcome this “memory wall.”
☑️By integrating Synopsys-certified HBM4/PHY IP, we deliver exceptional data throughput and higher system efficiency for AI and HPC applications.
☑️With TSMC CyberShuttle MPW prototyping and PGC’s ASIC turnkey services, customers can move from design to mass production faster, smarter, and with lower risk. 🚀

PGC empowers next-generation AI chips — enabling greater speed, flexibility, and performance for data centers, AI accelerators, and networking solutions.
👉 Read the full story: https://pse.is/88dclq

01/10/2025

🔎Looking back at ICDIA 2025 in Suzhou, we had an inspiring experience sharing our vision for the future of IC design.

Our booth highlighted how , #2.5D , and are reshaping semiconductor innovation—and how PGC’s TSMC DCA ASIC Turnkey Service is helping customers move faster from concept to production.

💡 Key highlights from the event:
✔️Chiplet-based architectures are becoming central to advanced design strategies.
✔️Advanced packaging and system-level co-optimization are emerging as the new battlegrounds.
✔️Ecosystem collaboration will be crucial for the next wave of semiconductor breakthroughs.
A big thank you to everyone who connected with us in Suzhou. Let’s continue the conversation and explore future collaborations!🙌

25/09/2025

🚀 PGC’s Highlights from DAC 2025!
This year’s DAC spotlighted AI-driven design, chiplet/3D integration, low-power innovation, and hardware security – all areas where PGC is actively investing.
Here’s what we deliver for our partners:
🔹 Comprehensive ASIC Turnkey design services
🔹 Chiplet / multi-die architecture design and verification
🔹 Low-power optimization for sustainable and high-performance applications
🔹 Functional safety design for automotive and industrial-grade standards

✨ From concept to mass production, PGC is here to guide you through every step of the ASIC journey.
👉 Want to start your ASIC journey today? Contact us for detail: https://pgc.pse.is/8647nl

📢Stay Tuned: Upcoming Events
11/20-11/21 ICCAD 2025📍Chengdu, China
11/23-11/25 IC China 2025 📍Beijing, China

24/09/2025

PGC accelerates humanoid robots with ASIC Turnkey solutions!🤖
From AI and image processing to motion control and low power design, PGC provides the expertise and IP portfolio to shorten time-to-market and reduce risks.🌠
👉 Learn how we help bring humanoid robots from concept to reality! https://pgc.pse.is/869g5r

隨著人形機器人（Humanoid Robots）成為科技產業的新焦點，半導體產業鏈也正出現顯著明顯變化，來自機器人應用的晶片訂單正快速增加，凸顯這一新興領域正在驅動先進製程與專用晶片（ASIC）的需求。隨著從各Tesla Optimus到Figure ...

17/09/2025

【2025 Exhibition Review Series #2】
We’re excited to share highlights from TSMC 2025 Japan Technology Symposium!
The event featured inspiring discussions on 2nm & 3nm advanced nodes, 3DFabric technologies, and the role of and in shaping next-generation applications.
For PGC, it was a great chance to connect with industry experts in Japan, exchange new ideas, and reaffirm our commitment to delivering world-class ASIC turnkey solutions.
🙏 Thank you to everyone we met at the symposium — your support fuels our innovation.
🚀 Coming Up Next: ICDIA China 2025!
👀 Learn more about our expertise in ASIC design: https://pgc.pse.is/854gj8