我們為半導體設備零組件供應商,專注半導體製程、設備零組件與關鍵材料應用,擁有多項發明專利,涵蓋雷射加工、晶圓切割、封裝結構與碳化矽(SiC)技術。提供藍寶石、陶瓷、SiC、石英(Quartz)材料與精密加工,應用於蝕刻、薄膜、擴散、黃光與自動化設備,提升良率並降低成本。
Address
牛埔南路264號
Hsinchu
300
Opening Hours
| Monday | 09:00 - 05:00 |
| Tuesday | 09:00 - 05:00 |
| Wednesday | 09:00 - 05:00 |
| Thursday | 09:00 - 05:00 |
| Friday | 09:00 - 05:00 |
Website
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