10/12/2025
FCBGA·FCCSP Lid Attach Process, Now with Greater Precision.
Metal lid attachment designed to protect packages under high-temperature and high-pressure conditions without deformation.
Precise dispensing, uniform bonding lines, and stable thermal transfer.
In advanced semiconductor packaging, the final level of completeness is defined by the lid attach stage.
Experience elevated packaging quality with Geo Technology’s precision dispensing solutions.
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