11/06/2026
Soldering will NOT disappear from EV power electronics by 2035.
But it will stop being the default.
As EV architectures move toward higher voltages, higher temperatures, and more compact designs, engineers are increasingly choosing connection technologies based on load profile — not habit.
We already see the shift happening:
→ SiC power modules are moving from solder to silver sintering for die attach because higher operating temperatures demand stronger thermal performance.
→ Compact automotive sensors and sealed housings increasingly use press-fit connections:
✔️ no heat
✔️ no flux
✔️ no cleaning process
✔️ insertion force monitored in real time
→ High-current busbars and battery tabs are rapidly adopting laser welding for precision and contamination-free assembly.
But solder is not going away.
For low-voltage PCB assemblies, control modules, infotainment, and many ADAS systems, traditional reflow soldering remains:
✔️ cost-effective
✔️ scalable
✔️ reliable enough for the application
The real industry shift is not “the end of solder.”
It’s the end of solder as the automatic default.
By 2035, EV electronics will likely rely on multiple joining technologies working side by side:
• sintering for high-temperature power semiconductors
• press-fit for reliable PCB interconnects
• laser welding for high-current connections
• soldering for standard PCB assembly
Different technologies for different physical demands.
And that’s exactly where power electronics engineering is heading.