28/05/2026
Chip performance will not come from scaling alone.
As AI, high-performance computing, and data-intensive applications increase the demands on semiconductors, advanced packaging is becoming a key lever for performance.
That is where materials matter.
Glass-core substrates can support the next generation of packages through a strong combination of surface quality, low warpage, positional accuracy, and electrical performance. But material properties alone are not enough. What matters is how well those advantages translate into reliable processing, stable production windows, and scalable manufacturing.
This is where our Semicon Glass Solutions team contributes by combining material, process, and application expertise to help turn the potential of glass into reliable packaging solutions.
Because beyond Moore’s Law, progress is not only about making chips smaller. I's about making the package perform.
Learn more about SCHOTT Semicon next: https://bit.ly/4viHbKE