SCHOTT AG

Name: SCHOTT AG
Address: Hattenbergstrasse 10, Mainz, 55122, DE
Telephone: +496131660

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Welcome to the official page of SCHOTT AG. Pioneering the impossible since 1884. When others say no, we say yes.

Because at SCHOTT we believe that shared responsibility can release the energy to achieve the impossible. As a global technology and material group, we are constantly exploring unique and innovative ways to make a difference for businesses and people. Being a foundation company, SCHOTT has anchored a responsibility for scientific research, society and the environment deeply in its DNA. Represented in over 30 countries by 17,100 employees, we are a highly skilled partner for many high-tech industries: Healthcare, Home Appliances & Living, Consumer Electronics, Semiconductors, Optics, Astronomy, Energy, and Aerospace. Whatever challenges the future might hold, we can’t wait to come up with innovative solutions and turn visions into reality. Imprint: https://www.schott.com/en-gb/imprint
Data protection information: https://www.schott.com/en-gb/legal-social

31/10/2026

We were scrambling for a last-minute Halloween costume… What do you think? Nailed it? 😉🎃

Happy Halloween everyone! 🧛‍♂️🧟‍♂️🤖🧙‍♀️

26/10/2026

“When we both started our careers, these materials were so exotic, so novel, so unique.”

Professor Kathleen Richardson and fellow 2026 Otto Schott Research Award recipient Professor Steve Martin have spent decades studying non-oxide glasses once considered far outside the mainstream.

Today, Martin studies how glass can function as a separator in solid-state batteries, while Richardson studies optical glasses and non-oxide materials for infrared optics and sensing.

Their research follows a question that goes back to Otto Schott himself: How can changes in chemistry and structure give glass entirely new properties?

Read more about their work and the history behind it in solutions magazine: https://www.schott.com/en-gb/solutions-magazine/otto-schott-research-award-2026-steven-martin-kathleen-richardson

22/10/2026

A successful glass sample is the first step in qualification. Scaling requires evidence from the intended package and manufacturing process.

For glass core substrates in advanced packaging, this means evaluating several connected requirements: CTE and mechanical properties within the stack, geometry and sidewall quality after TGV structuring, surface quality for RDL layering, and reliability after metallization and assembly.

The qualification plan should connect each requirement to a measurable acceptance limit. Results from individual process steps must then be checked against the complete flow, relevant thermal and mechanical loads, and variation across samples, lots, and larger formats.

We support this evaluation through application engineering, glass composition expertise, simulation, and structured samples. Our in-house structuring capabilities and collaboration with equipment and process partners help investigate how candidate glasses behave during processing.

For development teams, this provides a basis for selecting materials, identifying compatibility issues, and determining what evidence is still needed before scale-up.

Which uncertainty takes the longest to resolve in your qualification programs: process compatibility, reliability, or repeatability across lots and formats?

Access expert sessions and technical whitepapers from SCHOTT Semicon next:
https://www.schott.com/en-gb/trainings/semicon-next

15/10/2026

A major milestone for the world's largest telescope! 🔭

More than half of the mirror segments for the ESO Astronomy Extremely Large Telescope (ELT) have now arrived in Chile. Each one began its journey at our HQ in Germany, where our passionate teams produced the ZERODUR® glass-ceramic blanks that enable the telescope to capture unprecedented views of the universe.

With its near-zero thermal expansion, ZERODUR® provides the dimensional stability needed for this extraordinary project. Besides the gigantic segmented main mirror - which consists of 798 hexagons - the mirrors two, three, and four of the ELT’s optical system are also made of our glass-ceramic material.

A big thank you to everyone who has contributed to this achievement. From project management and glass melting to precision processing: Your expertise, dedication, and collaboration are helping bring this ambitious project to life.

Congratulations to ESO and all other partners involved!

Read ESO’s media release here: https://www.eso.org/public/announcements/ann26009/

📸 M. Mueller / SCHOTT

08/10/2026

A single successful through-glass via (TGV) shows that the geometry can be produced once. It does not show whether the same result can be repeated across a complete array.

Smaller is not automatically better. Diameter, pitch, glass thickness, and aspect ratio have to work with the complete process, from TGV structuring and etching to surface preparation, metallization, and inspection.

With strong expertise in glass structuring, we examine the resulting via arrays to understand how glass properties affect TGV formation and downstream processing. The findings support glass selection and material development for glass core substrates before scale-up.

Which part becomes the bottleneck first when scaling TGV arrays: geometry, sidewall quality, metallization, or inspection?

Explore SCHOTT Glass Panels for advanced semiconductor packaging: https://fcld.ly/fb_semicon_52

06/10/2026

More than a century ago, Otto Schott helped establish a new way of thinking about glass: its properties could be deliberately changed through chemistry.

That same idea runs through the work of Professors Steve Martin and Kathleen Richardson, recipients of the 2026 Otto Schott Research Award.

Martin studies how atomic structure governs glass behavior, including the use of glass in solid-state batteries. Richardson studies optical and non-oxide materials for infrared optics and sensing.

Their fields may look very different from Schott’s early experiments, but the underlying question remains familiar: What else can glass become?

Read the full story: https://www.schott.com/en-gb/solutions-magazine/otto-schott-research-award-2026-steven-martin-kathleen-richardson

01/10/2026

Stable semiconductor packages depend on how well their materials expand together.

In advanced packaging, selecting the right glass is therefore not simply about choosing the lowest coefficient of thermal expansion (CTE). It is a system decision.

This becomes particularly relevant when a glass core substrate (GCS) interacts with silicon, polymers, and the redistribution layer in chiplet and heterogeneous packaging architectures. The appropriate CTE depends on the materials, dimensions, and thermal conditions of the complete package stack.

To best support the semiconductor industry, we offer a broad portfolio of glass covering a CTE range from 3 to 10 ppm/K. This range allows engineers to select candidate glasses based on the application's thermomechanical requirements.

Mathematical modeling can then compare how different material combinations influence package or carrier warpage before application-specific samples enter qualification.

This separates two engineering questions: How will the stack deform under thermal load? And does the mechanical strength of the selected glass provide sufficient margin against the resulting stress?

Which parameter has most often affected your warpage results: CTE mismatch, Young’s modulus, layer thickness, or stack geometry?

Explore the technical properties of SCHOTT glass panels: https://fcld.ly/fb_sem

29/09/2026

Dr. Torsten Derr will step down as CEO of SCHOTT effective October 31, 2026. The decision was reached by mutual agreement for personal and family reasons. Stefan Brandl will take over as CEO on November 1, 2026.

Brandl joins us from the Dräxlmaier Group, a German automotive supplier, where he has served as Vice Chairman and CEO since 2021. Before that, he led the ebm-papst Group, a Germany-based manufacturer of electric motors and fans, as CEO from 2017 to 2021.

We sincerely thank Dr. Derr for his commitment to SCHOTT and his contributions during his time as CEO. We also look forward to welcoming Stefan Brandl and beginning this next chapter together.

With our team of almost 18,000 glass and high-tech materials enthusiasts around the world, we’ll continue to strengthen our competitiveness, advance innovation, and push the boundaries of materials science.

23/09/2026

115 years ago, our story began with pure glass. Today, FIOLAX® glass tubing remains a trusted foundation for pharmaceutical packaging, from vials and ampoules to cartridges and syringes that hold medicines people rely on every day.

The glass itself may often go unnoticed, but its quality, consistency, and reliability are essential. Building that trust has taken generations of experience, commitment, and a deep understanding of what the pharmaceutical industry requires.

That knowledge continues to shape what comes next. With FIOLAX® Pro, 115 years of expertise come together in a glass tubing platform developed for the future of pharmaceutical packaging.

Happy 115th birthday, FIOLAX®!

22/09/2026

Glass can play two very different roles in advanced semiconductor packaging: as a permanent part of the package in the form of a glass core substrate (GCS), or as temporary support during production in the form of a glass carrier.

As a glass core substrate, it provides a platform for through-glass via (TGV) structures and redistribution layers in chiplet packaging and other heterogeneous packaging architectures. Properties such as thermal expansion, dimensional stability, surface quality, and mechanical strength can directly affect TGV structuring, downstream processing, and long-term reliability.

As a carrier, glass stabilizes thin wafers or panels during production steps such as bonding, thinning, lithography, and inspection. Its transparency can also support alignment, inspection, and laser debonding before the carrier is removed.

These different functions call for fundamentally different glass engineering. For us, glass selection starts with the funciton our material must perform. Composition, format, thickness, and thermal behavior need to match the role the material performs.

Which presents the greater challenge in your current roadmap: the permanent substrate or the temporary carrier?

Explore how glass is contributing to the next generation of semiconductor packaging: https://fcld.ly/fb_semicon_50

Adresse

Hattenbergstrasse 10
Mainz
55122

Telefon

+496131660

Website

https://www.schott.com/german/legal2.html

Benachrichtigungen

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