Planoptik AG

Name: Planoptik AG
Address: Über der Bitz 3, Elsoff, 56479, DE
Telephone: +49266450680
Price range: ££

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Herzlich Willkommen auf der offiziellen Facebook-Seite der PLANOPTIK AG.

Follow us on LinkedIn ->
http://www.linkedin.com/company/plan-optik-ag
Follow us on Twitter ->
https://twitter.com/PlanOptikAG
Follow us on Xing ->
https://www.xing.com/companies/planoptikag
Follow us on Google+ ->
https://plus.google.com/+PlanOptikAGElsoff

Imprint -> https://www.facebook.com/Plan.Optik.AG/app_341709539297199

27/10/2026

Visit us at SEMICON Europa, November 10 – 13, 2026 in Munich.

We are excited to announce that PLANOPTIK AG will be exhibiting at SEMICON Europa!
Visit our booth #912 in hall B1 to explore our wide range of glass substrates and components for semiconductor manufacturing, including carrier wafers, adapters and tools, as well as glass wafers for MEMS and sensor packaging. We will also showcase our latest solutions for advanced packaging, including glass wafers, panels and glass core substrates.

We
https://www.planoptik.com/en/about_us/events/

19/10/2026

We are pleased to participate in this year’s IMPACT-IAAC Conference in Taipei!

Our colleague Jonas Discher is attending the conference and contributing to the technical program with the presentation »Material and Integration Requirements of Fused Silica Glass Core Substrates for High-Frequency Packaging«.

The presentation is highlighting our glass core substrates and glass wafer solutions for wafer-level and panel-level packaging.

Interested in learning more about our latest developments, technologies, and products for advanced packaging? Feel free to connect with Jonas during the conference. He will be happy to meet you, exchange ideas, and discuss potential applications.

Learn more about our solutions:
• Glass Core Substrates for Advanced Packaging
• Wafers for Wafer-Level Packaging
• Carrier Wafers, Adapters & Tools

More about the event at: https://planoptik.com/en/about_us/events/

09/09/2026

Don't miss our talk at ESTC SEPTEMBER 9–11, 2026! 💡

Heading to the IEEE ESTC Conference? Make sure to join our presentation on Glass Core Substrates and learn how we are enabling next-generation semiconductor packaging!

🎙️ Speakers: Jonas Discher
📖 Title: Enabling Next-Generation Packaging with Glass Core Substrates: Material, TGV, and Metallization Requirements
🗓️ When: September 10, 2026 @ 9:50 AM
📍 Where: Hall B (Session MIP 1)

We look forward to engaging technical discussions and networking in person. Reach out to set up a meeting with our experts in advance!

26/08/2026

Visit PLANOPTIK AG at SEMICON Taiwan 2026!

🗓 September 2 – 4, 2026

📍 Booth (Hall 1, 4th Floor)

Discover our latest glass-driven solutions for microsystems and semiconductor applications:
• Glass Core Substrates for advanced packaging
• High-precision Wafers & Substrates
• Wafers for Wafer-level packaging

Learn more about our customized solutions and meet our team on-site: 👉 https://www.planoptik.com/

with Carsten Wesselkamp

24/08/2026

Wir sind am Start! 🏃‍♂️🏃‍♀️

Am Freitag geht unser Team PLANOPTIK mit 21 starken Läuferinnen und Läufern beim Firmenlaufturnier in Bad Marienberg an den Start! 🔥
Die Laufschuhe sind geschnürt, das eigene Teamzelt (Platz Nr. 17) steht bereit und die Motivation ist riesig! 🎉🙌

Komm vorbei! 🎪🍻 Feuere uns an der 5-km-Strecke an oder schau danach bei uns am Zelt vorbei.

💼 Lauf nicht nur mit uns, sondern mach Karriere bei uns! Wir suchen Verstärkung für unser Team. Du willst Teil unserer Kultur werden? Sprich unsere Kolleginnen 👩‍💼 und Kollegen 👨‍💼 direkt am Zelt an oder check deine Karrieremöglichkeiten unter:
👉 https://www.planoptik.com/de/ueber_uns/jobs/

24/06/2026

As technology is rapidly moving forward, developers are aiming to implement as many chips and sensors as possible in the smallest spaces. The reduction of device and chip size plays an important role in enabling this implementation. For this reason, thickness reduction of the semiconductor wafers is requested in industrial or scientific applications like MEMs or optics. Thin semiconductor wafers are flexible and fragile. A temporary mechanical stabilization is needed in order to enable processing of the wafer and to further decrease device wafer thickness.
For this purpose, PLANOPTIK provides Carrier Wafers.

29/05/2026

🎓 Starte deine Karriere mit einem dualen Studium!

Du interessierst dich für Zahlen, Wirtschaft und möchtest Theorie und Praxis perfekt verbinden? Dann ist das genau dein Weg:

📌 Duales Studium – Steuern & Rechnungswesen (B.A.)
📅 Start: Wintersemester 2026/2027
🏢 Praxiseinstieg im Unternehmen: 01.08.2026

✅ Das bringst du mit:
Allgemeine Hochschulreife oder Fachhochschulreife

💼 Das erwartet dich:
Spannende Einblicke in die Welt der Steuern und des Rechnungswesens, kombiniert mit einem fundierten Studium.

👉 Klingt nach dir? Dann bewirb dich jetzt und starte deine Zukunft!

23/03/2026

The complexity of Hybrid Bonding and Electronics Packaging is hitting new levels—and we’re right in the middle of it. 🔬

Join us at ICEP 2026 at the International Conference Center Hiroshima, Japan.🇯🇵

We’ll be diving deep into the technical challenges of next-gen packaging and looking for new collaborations. Let’s grab a coffee and talk shop.☕
Drop a comment or DM to schedule a meeting!🤝

11/03/2026

Du willst praxisnah lernen und Verantwortung übernehmen?
Starte deine Ausbildung bei PLANOPTIK AG

Industriekaufmann/-frau (m/w/d)
Kaufmann/-frau für Digitalisierungmanagement (m/w/d)

Jetzt online bewerben oder direkt an [email protected] schreiben.
Mehr Info : planoptik.com/de/karriere/

23/02/2026

🇰🇷Driving Innovation in Semiconductor Packaging: Insights from 🇰🇷

The semiconductor industry is evolving rapidly, and staying at the forefront of these changes is essential. Our vice president of sales Carsten Wesselkamp, recently attended the event to discuss the shifting landscape of high-performance computing and the materials defining the future.

A major takeaway from the discussions: The rise of glass substrates.
As AI applications demand more power and efficiency, traditional materials are reaching their physical limits. Glass is emerging as a critical solution for next-generation packaging due to its superior thermal stability and electrical performance. At , we are proud to contribute our long-standing expertise in and precision glass processing to this global value chain.

Supported by the , this visit was a great opportunity to engage with industry leaders and exchange ideas on how specialized glass solutions can overcome current hardware bottlenecks.

🔍 Read the Full Interview
For those interested in the technical details and market trends regarding glass substrates in the AI era, you can read Carsten Wesselkamp’s full interview here: 👉 Read the article on DigitalToday : http://bit.ly/4rawvvb

Adresse

Über Der Bitz 3
Elsoff
56479

Telefon

+49266450680

Website

http://www.planoptik.com/

Benachrichtigungen

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