28/11/2025
✨WaferBond '25: The essential meeting for 3D Integration in Chemnitz!✨
For everyone driving the future of Microsystems: From December 3rd to 4th, 2025, Chemnitz, Germany, will be the central hub for all things Wafer Bonding and 3D- and Wafer Level Integration.
This event is a must-attend if you are looking to dive deep into topics like Fluidics, advanced Testing, and Substratetechnologies.
Key Highlights:
🗓️ Dec 3rd & 4th, 2025 (Starting with an Evening Reception on Dec 2nd for networking)
🤝 Over 180 expected participants for intense knowledge exchange.
🗣️ Around 60 contributions (oral and poster presentations).
🔬 Lab tours at Fraunhofer ENAS – A unique look behind the scenes of leading research!
We are proud to announce that we are a SILVER SPONSOR this year!
We look forward to meeting you personally at our exhibition spot, presenting our latest solutions, and driving the discussions on the next generation of advanced packaging.
Save the date and let’s talk substrates, capping, and integration in Chemnitz!🤝
Address: c/o56 Hotel Chemnitz, Salzstrasse 56, 09113 Chemnitz, Germany