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The complexity of Hybrid Bonding and Electronics Packaging is hitting new levels—and we’re right in the middle of it. 🔬J...
23/03/2026

The complexity of Hybrid Bonding and Electronics Packaging is hitting new levels—and we’re right in the middle of it. 🔬

Join us at ICEP 2026 at the International Conference Center Hiroshima, Japan.🇯🇵

We’ll be diving deep into the technical challenges of next-gen packaging and looking for new collaborations. Let’s grab a coffee and talk shop.☕
Drop a comment or DM to schedule a meeting!🤝

11/03/2026

Du willst praxisnah lernen und Verantwortung übernehmen?
Starte deine Ausbildung bei PLANOPTIK AG

Industriekaufmann/-frau (m/w/d)
Kaufmann/-frau für Digitalisierungmanagement (m/w/d)

Jetzt online bewerben oder direkt an [email protected] schreiben.
Mehr Info : planoptik.com/de/karriere/

🇰🇷Driving Innovation in Semiconductor Packaging: Insights from  🇰🇷The semiconductor industry is evolving rapidly, and st...
23/02/2026

🇰🇷Driving Innovation in Semiconductor Packaging: Insights from 🇰🇷

The semiconductor industry is evolving rapidly, and staying at the forefront of these changes is essential. Our vice president of sales Carsten Wesselkamp, recently attended the event to discuss the shifting landscape of high-performance computing and the materials defining the future.

A major takeaway from the discussions: The rise of glass substrates.
As AI applications demand more power and efficiency, traditional materials are reaching their physical limits. Glass is emerging as a critical solution for next-generation packaging due to its superior thermal stability and electrical performance. At , we are proud to contribute our long-standing expertise in and precision glass processing to this global value chain.

Supported by the , this visit was a great opportunity to engage with industry leaders and exchange ideas on how specialized glass solutions can overcome current hardware bottlenecks.

🔍 Read the Full Interview
For those interested in the technical details and market trends regarding glass substrates in the AI era, you can read Carsten Wesselkamp’s full interview here: 👉 Read the article on DigitalToday : http://bit.ly/4rawvvb

Advancing Semiconductor Packaging in Phoenix 🌵We are headed to the Device Packaging Conference 2026! As the industry mov...
16/02/2026

Advancing Semiconductor Packaging in Phoenix 🌵

We are headed to the Device Packaging Conference 2026! As the industry moves toward more complex architectures, the limitations of traditional substrates are becoming a critical bottleneck. PLANOPTIK AG is at the forefront of solving these challenges with high-precision glass solutions.

📍 Visit us at Booth 606 to discuss how our glass wafers and TGV technology can stabilize your next-gen roadmaps.

A key highlight of the event: Our colleague Jonas Discher will be delivering a technical presentation on the integration of glass in modern packaging.
🎤 Topic: Enabling Next-Generation Packaging with Glass Core Substrates: Material, TGV, and Metallization Requirements
🕒 Time: 17:00 – 17:30 📅
Date: March 3rd, 2026

Don't miss the chance to get technical insights into the future of Glass Core Substrates. See you in Phoenix, AZ! 🇺🇸

We are excited to announce that we are participating in the Semiconductors Korea 2026 Business Mission 🇰🇷⚙️From 9–13 Feb...
02/02/2026

We are excited to announce that we are participating in the Semiconductors Korea 2026 Business Mission 🇰🇷⚙️

From 9–13 February 2026, we will be in Seoul, Republic of Korea, together with leading European companies and stakeholders from the semiconductor ecosystem.

🤝 We are very pleased and proud to be part of this mission, which offers a great opportunity to:

Strengthen EU–Korea business cooperation
Exchange insights on semiconductor technologies and innovation
Build new partnerships and explore market opportunities
A big thank you to the EU Business Hub and everyone involved in making this possible.

✨We are very much looking forward to engaging discussions and valuable connections in Seoul!✨

Join us at IEEE MEMS 2026 in Salzburg! 🇦🇹We are thrilled to be part of the 39th IEEE MEMS 2026 here in beautiful Austria...
26/01/2026

Join us at IEEE MEMS 2026 in Salzburg! 🇦🇹

We are thrilled to be part of the 39th IEEE MEMS 2026 here in beautiful Austria! From groundbreaking research to industry applications, we’re looking forward to every bit of it.
We are especially excited to connect with our partners, colleagues, and friends in person. Come visit us at Booth #21 to catch up or discuss how we can collaborate on your next project.

📍 Location: Salzburg Congress 🎯 Booth: #21

Looking forward to seeing you all!

We’re officially live at SPIE Photonics West 2026 in San Francisco!The booth is set, the coffee is ready (or at least th...
21/01/2026

We’re officially live at SPIE Photonics West 2026 in San Francisco!
The booth is set, the coffee is ready (or at least the energy is), and we’ve brought our latest glass innovations with us. If you’re at the Moscone Center, don't just walk past – stop by for a quick talk.

📍 Find us at Booth #4128

We’re ready to talk about:
Glass & Packaging Wafers (Structured substrates for your next big project)
Glass Core Substrates (The future of advanced packaging)
Custom Solutions for MEMS & Photonics
Let’s discuss how we can solve your specific microelectronics challenges. See you at the booth!

🏆 Ein außergewöhnlicher Meilenstein: 40 Jahre Angelika Arhelger bei PLANOPTIK AG! 🏆🌟 Wir gratulieren unserer geschätzten...
28/11/2025

🏆 Ein außergewöhnlicher Meilenstein: 40 Jahre Angelika Arhelger bei PLANOPTIK AG! 🏆

🌟 Wir gratulieren unserer geschätzten Kollegin Angelika Arhelger zu ihrem 40-jährigen Betriebsjubiläum. Vier Jahrzehnte der Loyalität, des Engagements und der Expertise sind eine bemerkenswerte Leistung, die höchsten Respekt verdient. 🌟

Ihre langjährige Erfahrung ist ein unschätzbarer Wert für unser gesamtes Team und hat die Entwicklung unseres Unternehmens maßgeblich mitgeprägt.
Für diesen großartigen Einsatz bedanken wir uns herzlich und freuen uns auf die weitere Zusammenarbeit.
🎉 Herzlichen Glückwunsch, liebe Angelika! 🎉

********************************************************************************

🏆 An Exceptional Milestone: 40 Years of Angelika Arhelger at PLANOPTIK AG!🏆

🌟 We warmly congratulate our valued colleague Angelika Arhelger on her 40th work anniversary. Four decades of loyalty, commitment, and expertise are a remarkable achievement that deserves the highest respect. 🌟

Her many years of experience are an invaluable asset to our entire team and have played a major role in shaping the development of our company. We sincerely thank her for this great dedication and look forward to continuing to work together.

🎉 Happy Anniversary, dear Angelika Arhelger 🎉

✨WaferBond '25: The essential meeting for 3D Integration in Chemnitz!✨For everyone driving the future of Microsystems: F...
28/11/2025

✨WaferBond '25: The essential meeting for 3D Integration in Chemnitz!✨

For everyone driving the future of Microsystems: From December 3rd to 4th, 2025, Chemnitz, Germany, will be the central hub for all things Wafer Bonding and 3D- and Wafer Level Integration.
This event is a must-attend if you are looking to dive deep into topics like Fluidics, advanced Testing, and Substratetechnologies.

Key Highlights:
🗓️ Dec 3rd & 4th, 2025 (Starting with an Evening Reception on Dec 2nd for networking)
🤝 Over 180 expected participants for intense knowledge exchange.
🗣️ Around 60 contributions (oral and poster presentations).
🔬 Lab tours at Fraunhofer ENAS – A unique look behind the scenes of leading research!

We are proud to announce that we are a SILVER SPONSOR this year!
We look forward to meeting you personally at our exhibition spot, presenting our latest solutions, and driving the discussions on the next generation of advanced packaging.

Save the date and let’s talk substrates, capping, and integration in Chemnitz!🤝

Address: c/o56 Hotel Chemnitz, Salzstrasse 56, 09113 Chemnitz, Germany

💡We're attending! Our team is excited to be on the ground at the IEEE Electronics Packaging Technology Conference Singap...
26/11/2025

💡We're attending! Our team is excited to be on the ground at the IEEE Electronics Packaging Technology Conference Singapore 2025 (EPTC).💡

For us, this is the essential platform to discuss the newest developments in Electronics Packaging and Heterogeneous Integration. This is where the future direction of semiconductor architecture is shaped.🔥

We look forward to meeting you personally! If you are also attending and want to discuss your biggest challenges in chip manufacturing or product development.

🤝Let's connect at 2nd to 5th December 2025 in Singapore!🤝

SEMICON Europa 2025, here we come! 🇩🇪We're looking forward to connecting with industry leaders and sharing our expertise...
06/11/2025

SEMICON Europa 2025, here we come! 🇩🇪

We're looking forward to connecting with industry leaders and sharing our expertise.

Find us at Booth B1912! Let's talk business.

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