Jufengsolder

27/08/2026

PCIM Asia Shenzhen 2026 is in full swing!

Joinspire is showcasing new material solutions for power electronics, including silver sintering materials, copper sintering materials, and via-filling copper paste.

Visit Hall 16, Booth B42 from August 26–28 to explore material solutions for power modules, semiconductor devices, and advanced electronic packaging.

21/08/2026

Have you ever seen the soldering effect of solder wire under a microscope?

14/08/2026

China's original factory, solder paste, available worldwide, does anyone need it?

29/07/2026

Solder bars for the new‑client order are under production.

Our workers are processing on‑site to ensure good quality and timely shipment. ❣️ ❣️ ❣️

27/07/2026

What Causes Uneven Joint Height in BGA Packaging?

The answer is not always the reflow profile.

Solder ball diameter, sphericity, placement accuracy, pad condition, and thermal distribution can all influence the final joint geometry.

Among these factors, solder ball consistency is often overlooked.

Using solder balls with uniform size and stable alloy composition can help improve joint-height consistency and reduce variation across the package.

Reliable packaging begins with controlling the smallest details.

20/07/2026

17/07/2026

The staff are working hard. Do you know what this is?

08/07/2026

Let's take a look at how Sn63Pb37 works

01/07/2026

🌿 **June 29-30 | Team Building in Conghua, Guangzhou**

The **Jufeng** and **Joinspire** teams enjoyed two wonderful days together in beautiful **Conghua, Guangzhou**.

From BBQ and off-road driving to river rafting, a bonfire night, team games, and a visit to the famous Longevity Village, it was a great opportunity to relax, connect, and strengthen our teamwork.

A stronger team builds better products. 💙

10/06/2026

Day 2 in Nuremberg, Germany PCIM

Great conversations and valuable connections today around next-generation die attach materials.

We showcased both Pressure Sintering Copper and Pressureless Sintering Copper solutions, designed to meet the growing demands of high-power electronics, semiconductors, EVs, and advanced packaging.

✔ High thermal conductivity
✔ Excellent reliability
✔ Lead-free and future-ready solutions

The interest in copper sintering technology continues to grow as manufacturers seek more efficient and sustainable alternatives for power device assembly.

Looking forward to more discussions and partnerships in the days ahead!