11/11/2025
Our latest article explores Si₃N₄‑AMB‑Cu ceramic copper‑clad substrates in depth. Highlights include:
🔹 800 MPa bending strength
🔹 8.0 MPa·m¹/² fracture toughness
🔹 Reliable performance under −45 °C to 150 °C thermal cycling
Compared with AlN and Al₂O₃, Si₃N₄ substrates achieve significantly longer service lifetimes, supporting ⚡ IGBT modules in 🚄 high‑speed rail, 🚗 EVs, and 🌍 smart grids.
📖 Full article: https://www.kinjipcb.com/news/23.html