23/10/2026
MECHANIC Preheating Platform IX50
Motherboard chip desoldering, solder reflow removal, component preheating, BGA/CPU hard drive assembly/disassembly, PCB layering and bonding, solder removal and rework, optional IP11-18 cutout modules for expanded heating scenarios.
Preheating temperature range: 40-260℃
Product power: 62W