11/08/2026
0.02mm Accuracy. Flawless BGA Rework.
Hi‑620D Optical Alignment BGA Station – Built for the AI‑Era Repair Boom
The global GPU repair market is now $8.5B+, with China alone expected to hit ¥20B in 2026. As export controls tighten, thousands of high‑end AI chips (H100, A100, Blackwell) are entering the aftermarket repair channel – and chip‑level rework accuracy has never been more critical.
Enter the Hi‑620D. Engineered with 0.02mm optical alignment, it delivers the precision needed for today’s dense 2.5D/3D chiplet packages, ultra‑fine pitch BGAs, and high‑power AI accelerators. Whether you’re repairing a failed H100 in a data centre, a Tesla xEV controller, or a drone flight module, placement errors are no longer an option.
Trusted across high‑tech industries:
✔ Game Consoles & Mobile Devices
✔ Industrial Controls & Robotics
✔ Drones & UAV Avionics
✔ AI Chips (NVIDIA, AMD, Huawei Ascend)
✔ Tesla xEV Power Modules
✔ MacBooks & High‑end Laptops
Why the Hi‑620D is your competitive edge:
Optical alignment eliminates blind placement – critical when every pad must be perfect.
Closed‑loop temperature control ensures safe rework on large, thermally sensitive substrates.
Zero‑damage profiling supports lead‑free and high‑temperature solder alloys used in automotive and AI applications.
With the aftermarket repair sector growing at double‑digit rates and a severe shortage of skilled chip‑level repair houses, equipping your workshop with the Hi‑620D means you can capture the rising tide of AI, automotive, and industrial rework orders – profitably and reliably.
Stop guessing placements. Start mastering precision.
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