Fully China-Made Solid State Drive - SSD

03/06/2026

High Efficiency Single-phaseEDF Din-rail Power Supply Series
Product Features:

Full range AC input, DC input (全范围交流/直流输入)
Air cooling, compact size (风冷散热，体积紧凑)
High reliability, high efficiency (高可靠性，高效率)
150% peak load capacity (可承受150%峰值负载)
110% continuous power output (支持110%持续功率输出)
Active PFC, built-in decoupling (主动式PFC，内置去耦电路)
DC OK relay (配备DC正常状态继电器)
Conditional LED indicator lighting (带条件触发的LED指示灯)
Optional conformal coating protection version (可选保形涂层防护版本)
Compatible with TS35/7.5 or TS35/15 mounting; supports backplane installation (适配TS35/7.5或TS35/15导轨安装，支持背板安装)
Screwless wiring terminals (免螺丝接线端子)
Available models: 12V, 36V, 48V output voltages (提供12V/36V/48V多种输出电压型号)

19/05/2026

SDR Software-Defined Radio Core Baseband Board Based on ZYNQ7030 FPGA + AD9361
1. Introduction
The SDR series software-defined radio core baseband board is a dual-channel, 2x2 (2 transmit, 2 receive) high-performance Mesh ad-hoc networking motherboard developed on a Software Defined Radio (SDR) platform, as illustrated in Figure 1. This SDR platform is a high-cost-performance solution specifically engineered for wireless broadband ad-hoc communication systems. It combines the Zynq7030 programmable System-on-Chip (SoC) with the AD9361 integrated RF transceiver chip to provide a 2x2 MIMO wireless ad-hoc transmission path covering a frequency range from 70 MHz to 6 GHz.
2. Application Scope of the SDR Platform
(1) Validation of wireless communication systems.
(2) Wireless communication links for Unmanned Aerial Vehicles (UAVs).
(3) Wireless communication modules or units within electronic systems (can be used without an enclosure).
(4) Experiments and teaching in mobile communications.
(5) Broadband wireless ad-hoc networking radios.
(6) Data acquisition and signal processing.
3. SDR Platform Performance Metrics
Core Hardware Specifications:
● FPGA: Zynq 7030, featuring an integrated dual-core ARM Cortex-A9 processor.
● RF Channels: 2 Transmit channels and 2 Receive channels.
● Operating Frequency Band: 70 MHz to 6 GHz.
● Signal Bandwidth: Software-adjustable from 200 KHz to 56 MHz.
● Transmit Power: 10 dBm, with the option to customize external power amplifiers up to a maximum of 30W.
● Transmit EVM: ≤ 3%.
● ADC: Dual-channel, 12-bit @ 61.44 Msps.
● DAC: Dual-channel, 12-bit @ 61.44 Msps.
● DDR3: 2 × 256MB DDR3 SDRAM.
● Reference Clock: 40 MHz.
● Optional Configurations: Supports the selection of external power amplifiers and filters, as well as Low Noise Amplifiers (LNA) and built-in power amplifiers.
Functional Indicators of the High-Performance Mesh Ad-hoc Networking Core Board:
● Supports distributed, centerless, dynamic, and rapid networking.
● Supports automatic multi-hop routing and relay transmission.
● Supports unicast, multicast, and broadcast transmission modes.
● Supports interface customization, including multiple network ports, RS232, RS422, RS485, and WIFI AP.
● Supports RF channel customization, with options for single-channel (single antenna) or dual-channel (dual antenna) configurations.
● Supports voice mode customization, with options for VOIP voice conferencing and PTT voice intercom.
● Supports transparent IP data transmission.
● Supports transparent serial data transmission, including network-to-serial and serial-to-serial bridging.
● Supports channel encryption using DES, AES128, and AES256.
● Provides indications for environmental noise floor, signal strength, and link quality.
● Provides interference level indication.
● Supports wireless remote configuration and one-click configuration for the entire network.
● Supports customization of the product enclosure.
● Supports customization of configuration and management software.
Performance Indicators:
● Network Scale: Supports networking applications for up to 64 nodes.
● Frequency Range: Supports a customizable frequency range of 70 to 6000 MHz.
● Bandwidth Modes: Supports multiple bandwidth modes including 2.5, 5, 10, and 20 MHz (Note: the ZYNQ 7030 supports the 20 MHz mode).
● Modulation Methods: COFDM, BPSK/QPSK/16QAM/64QAM/256QAM.
● Receive Sensitivity: Less than -100 dBm @ 2.5 MHz.
● Transmission Rate: Peak rates of 65 Mbps @ 10 MHz and 125 Mbps @ 20 MHz.
● Power Output: Customizable power levels ranging from 0.5W to 30W.
● High-Speed Mobility: Supports node movement rates exceeding 2000 km/h.
● Startup Time: Cold start and network access time is less than 28 seconds; hot start network access time is less than 1 second.
● Routing Relay: Capable of up to 15 hops for short messages, 8 hops for voice, and over 6 hops for video.
● Routing Switchover: Less than 800 milliseconds.
● Operating Temperature: Supports a wide temperature range of -40°C to +65°C.

06/05/2026

I. Product Overview
This motherboard is a fully domestically produced multi-core heterogeneous intelligent processing platform, specifically designed for the military, information technology application innovation (IT application innovation), high-end embedded systems, and edge computing sectors. It adopts a three-core heterogeneous architecture featuring "domestic FPGA + Phytium CPU + Tianhe Zhixin GPU," integrating multiple high-end, independently developed domestic chips. This platform balances general-purpose computing, parallel signal processing, and AI acceleration capabilities to meet the high-reliability and high-performance computing demands in complex environments. It is suitable for critical applications such as radar signal processing, electronic countermeasures, aerospace, industrial measurement and control, and AI edge inference.

II. Core Hardware Configuration
1. Three-Core Heterogeneous Computing Power
Core Chip Types, Models, Positioning, and Core Capabilities:

FPGA: The Fudan Microelectronics JFM7VX690T80 (marked on-board) is a high-end domestic FPGA based on the Virtex-7 architecture, compatible with the Xilinx XC7VX690T. It boasts ultra-large-scale logic resources and high-speed transceivers, serving as the core for signal processing, high-speed interfacing, and algorithm hardware acceleration. It supports military-grade wide temperature operation to meet the high-reliability requirements of critical scenarios.
CPU: The Phytium E2000 embedded processor is a domestic ARM-based general-purpose processor. It is responsible for system scheduling, business logic ex*****on, peripheral management, and general-purpose computing. It achieves a fully domestic main control solution, ensuring stable operation in embedded, industrial control, and military applications.
GPU: The Tianhe Zhixin Zhikai 50 general-purpose GPU is a high-performance domestic GPU designed for general computing. It delivers powerful AI inference, floating-point operations, and parallel acceleration capabilities, supporting compute-intensive tasks such as deep learning, data processing, and image signal processing.
2. Expansion Sub-Cards and Supporting Circuitry
ACUS-SMR100 Sub-Card (PN: p396A): This is an independent modular sub-card that integrates dedicated processing chips and power management circuits. It enables customized functions such as RF signal processing, high-speed data acquisition, and interface expansion. It supports modular upgrades to cater to the diverse needs of different industry scenarios.
Supporting Storage and Control Chips: The board is equipped with domestic DDR memory, Flash storage, and power management chips. These components provide stable storage and power support for the three-core heterogeneous architecture, ensuring full-chain localization.
3. Interface and Expansion Capabilities
High-Speed Peripheral Interfaces: The board features USB 3.0/2.0 interfaces, SMA RF interfaces (supporting high-frequency signal input/output), D-SUB high-current interfaces, and high-speed connectors to meet the demands for data transmission, device interconnection, and external expansion.
Industrial/Military-Grade Interfaces: GPIO, serial ports, and debugging interfaces are reserved to support secondary development and customized function expansion, adapting to the diverse connection requirements of industrial and military scenarios.
Status Indication: On-board LED indicators provide real-time feedback on power, operation, and interface status, facilitating debugging and maintenance.
4. Power Supply and Reliability Design
Military-Grade Power Management: Utilizing multi-channel independent power rails, high-current MOSFETs, and an efficient DC-DC solution, the board ensures stable power supply for multiple chips. It supports wide-voltage input and incorporates over-current, over-voltage, and surge protection.
Thermal and Structural Design: The board reserves mounting positions for large-area heat sinks and uses customized thermal grease, supporting both air and liquid cooling. It adopts a reinforced PCB design with plated mounting holes to meet the requirements for operation in harsh environments involving vibration, shock, and extreme temperatures.
Fully Domestic Supply Chain: All core chips and components are sourced from domestic, independently controllable solutions, eliminating dependence on foreign suppliers and complying with the localization requirements of IT application innovation and military sectors.
III. Core Technical Advantages
1. Three-Core Heterogeneity for Full-Scenario Computing Coverage
The FPGA handles high-speed signal processing and hardware acceleration, the Phytium E2000 manages general-purpose computing and system scheduling, and the Zhikai 50 performs AI inference and parallel computing. These three components work in synergy to balance real-time performance, versatility, and computing density, flexibly adapting to various tasks such as signal processing, AI inference, and data encryption.

2. Full Autonomy and Controllability for Security Compliance
With 100% domestic core chips, the platform achieves autonomy and controllability from hardware to underlying software. It meets the security and compliance requirements of critical national sectors (military, government, energy) and eliminates the risk of supply chain disruptions.

3. High-Reliability Military-Grade Design
Featuring wide-temperature operation, a reinforced structure, redundant power supplies, and anti-interference design, the platform complies with GJB (National Military Standards). It is capable of stable 7×24-hour operation in extreme environments.

4. Modular Scalability for Strong Adaptability
The platform supports sub-card expansion and interface customization, allowing for rapid adaptation to different application scenarios. This reduces customer customization costs and shortens the product development cycle.

IV. Typical Application Scenarios
Military Electronics: Radar signal processing, electronic countermeasures, airborne/shipborne embedded computing, missile guidance systems, and military edge computing nodes.
IT Application Innovation Sector: Domestic server acceleration cards, security gateways, data encryption equipment, and core boards for IT application innovation industrial computers.
High-End Industry: Industrial real-time control, high-speed data acquisition, edge computing gateways, intelligent measurement and control systems, and industrial AI vision.
Scientific Research and Custom Development: FPGA algorithm verification, heterogeneous computing platform R&D, and prototype development for dedicated signal processing systems.
V. Product Specifications (Core Parameters)
Core Architecture: Domestic FPGA + Phytium E2000 CPU + Tianhe Zhixin Zhikai 50 GPU three-core heterogeneous architecture.
Main FPGA: Fudan Microelectronics JFM7VX690T80 (compatible with XC7VX690T).
Main CPU: Phytium E2000 embedded processor.
Main GPU: Tianhe Zhixin Zhikai 50 general-purpose GPU.
Operating Temperature: -40℃ ~ +85℃ (Military-grade option: -55℃ ~ +125℃).
Interface Types: USB, SMA RF, D-SUB, high-speed connectors, GPIO, debugging interfaces, etc.
Localization Rate: 100% domestic core components.
Power Supply: Wide-voltage DC input (12V/24V customizable).
Structure: Reinforced PCB, supporting rack-mounted or embedded installation.
VI. Customization Services
We provide the following services tailored to customer needs:

Chip Solution Customization: Replacing different models of domestic FPGA/CPU/GPU.
Interface and Function Customization: Adding specific communication interfaces or acquisition modules.
Underlying Software Development: Including BSP (Board Support Package), drivers, algorithm porting, and AI model adaptation.
Military-Grade Environmental Reliability Testing and Certification.

30/03/2026

Product Introduction:
The FPGA processing board is designed as a standard ruggedized VPX air-cooled module, powered by +12V DC. The single board is primarily composed of one FPGA chip, optical modules, and interface modules such as DDR4.

Technical Features:
With the FPGA serving as the core processor, the board performs functions including external optical signal data communication, data computation, and interface control. Peripheral interfaces include optical ports, DDR4 interfaces, IIC interfaces, BPI interfaces, Gigabit Ethernet, USB UART interfaces, temperature monitoring, and clock interfaces.

Main Technical Specifications:

FPGA Model: XCVU13P-2FHGB2104I;
Memory: Equipped with 2 sets of 4GB DDR4;
Optical Modules: Supports 3 groups of 12-channel transceiver optical modules with a rate of 25.78125 Gbps;
SFP28 Interface: Supports 4-channel 25.78125 Gbps SFP28 optical interfaces;
Network Interface: Supports 2-channel Gigabit Ethernet interfaces;
USB Interface: Supports 1-channel USB serial port;
Clock: Supports external reference clock;
Indicators: Equipped with module power indicators and working status indicators;
Health Management: Features IPMC (Intelligent Platform Management Controller) health management;
Architecture: Standard VPX architecture;
Operating Temperature: -40℃ to +55℃.

16/03/2026

16/03/2026

ORIN+FPGA High-Speed AI Processing Board
This is the mainboard, which requires a matching interface board to complete various functions. Our business offers customized interface boards and designs related software, reducing customers' R&D time, costs, and risks while accelerating product launch time.
Application Scenarios:
Using the FMC interface of the FPGA, create CameraLink interface boards, CoaxPress interface boards, and 10G Ethernet interface boards to connect area and linear cameras, applying ORIN to machine vision applications. Ideal for environments with limited space, moisture, dust, extreme temperatures (high/low), vibrations, and complex electromagnetic interference.
With the FMC interface of the FPGA, develop 12G SDI interface boards and HDMI interfaces to apply ORIN in broadcast video, medical, educational, live production recording scenarios.
Connect AD9361 and ADV9009 interface boards via the FMC interface of the FPGA, applying ORIN to AI+ software radio fields.
Use the FMC interface of the FPGA to build JESD204B interface boards, connecting advanced A/D and D/A chips for analog signal acquisition and intelligent processing, applied in distributed optical fiber signal processing.
Connect a 24-bit high-precision A/D converter via the FMC interface of the FPGA for IEPE vibration monitoring of large rotating equipment and wind turbine operation monitoring.
Applications in robotics and UAVs.
Board Architecture:
The board adopts an ORIN+FPGA architecture. ORIN is an embedded chip specifically designed by NVIDIA for edge AI and robotics, fabricated in 7nm process technology with single-chip computing power reaching 157 TOPS, supporting parallel processing of multiple sensors. The board offers optional configurations:
ORIN NANO 4G module
ORIN NANO 8G module
ORIN NX 8G module
ORIN NX 16G module
The FPGA uses Xilinx Kintex UltraScale+ series XCKU5P-2FFVB676I or Xilinx Artix UltraScale+ XCAU15P-2FFVB676I, with pin compatibility. The latter supports PCIe Gen4 at 16 GT/s for faster communication speeds. The architecture diagram is as follows:
Board Introduction
The ORIN side features a DisplayPort display interface.
The ORIN side includes 4× USB 3.0 ports.
The ORIN side has an RJ45 Gigabit Ethernet interface.
The ORIN side includes a USB Type-C interface.
The ORIN side is equipped with a 1TB SSD (read speed: 3,180 MB/s, write speed: 2,960 MB/s).
The ORIN side supports a 5G full-network module and a Wi-Fi module.
The FPGA side includes 2GB DDR4-2600 memory.
The FPGA side features dual QSPI flash (MT25QU256###x).
The FPGA side supports single-ended 80 MHz and differential 200 MHz clocks, along with the SI5328B-C-GMR clock.
The board features an onboard FMC interface with 10-lane GTY and 54 pairs of LVDS.
The board uses industrial-grade chips. The structure meets shock resistance requirements.

Physical Specifications
Operating temperature:
ORIN module: -25°C to 70°C wide temperature range operation.
Other components: Industrial grade, -40°C to +85°C.
Humidity range: 10% to 80%.
Power supply requirements:
Single power supply, total board power consumption: 40W.
Voltage: DC +12V, 5A.
Ripple: ≤10%.
Board dimensions: 186mm × 115mm.
Reference Chassis
To facilitate user usage, customized chassis have been designed for customers (see image below). An alternative slightly smaller chassis is also available, which still meets requirements. The board design was coordinated with manufacturers to ensure compatibility with chassis dimensions. Custom drilling, installation of cooling fans, and heat sink fins can be added according to user requirements.

28/01/2026

FPGA and DSP-based Signal Recognition Processing Board
1.Overview
Our company possesses the capabilities for fully domestically produced design, simulation, and test development of data boards based on FPGA and DSP. The signal recognition and processing board based on FPGA+DSP is a board that operates under a real-time operating system. It is used in a certain flight system to control overall module management and external information data interaction, completing the digital intermediate frequency (IF) signal processing function. This board includes one FPGA chip, two DSP chips, three QSPI FLASH chips, and four DDR3 chips.
Key Features:
Read/write rate between FPGA and backplane EMIF is ≥6 Mbytes;
Data rate for each DSP accessing FPGA dual-port RAM is ≥10M bytes/s;
SRIO rate between DSP and FPGA is ≥3.125Gbps;
SRIO rate between DSPs is ≥3.125Gbps;
I/Q baseband frequency acquisition range: 0 ~ 300kHz;
I/Q baseband acquisition amplitude: ≤1.68vp-p/50Ω.
2. Technical Specifications
AD Sampling Bits: 14-bit;
AD Sampling Frequency: ≥2 MHz;
AD Effective Number of Bits (ENOB): ≥11-bit;
Frequency Range: 0 ~ 300kHz;
Amplitude: ≤1.5Vp-p/50Ω;
Model: FT-M6678N;
Main Frequency: ≥1GHz;
Operation Mode: Little Endian mode;
DDR3: ≥1GBytes capacity, 32-bit width, read/write clock ≥667MHz;
Data rate for DSP accessing dual-port RAM within FPGA is not less than 10M bytes/s;
DSP1 and DSP2 are independently designed and can be assembled to work separately, with a combined power supply design possible;
Model: JFM7K325T;
Maximum Power Consumption: 20W;
Operating Temperature Range: -40℃ ~ +70℃;
Component Dimensions: 160.3mm x 100mm x 20mm;
Component Weight: 365g.
3. Application FieldsApplied in radar signal detection systems.

27/01/2026

ORIN+FPGA High-Speed Acquisition AI Intelligent Processing Board For inquiries and orders, contact WhatsApp: +86 156 8089 4064
I. Application Scenarios:
1. Utilizing the FPGA's FMC interface to create Cameralink interface boards, Coaxpress interface boards, and 10G Ethernet interface boards, connecting area scan and line scan cameras, applying ORIN to machine vision fields. Particularly suitable for occasions with limited space, humidity, dust, high temperature, severe cold, vibration, and complex electromagnetic environments.
2. Using the FPGA's FMC interface to create 12G SDI interface boards and HDMI interfaces, applying ORIN to broadcast video, medical, education, live streaming, recording, and playback fields.
3. Connecting ad9361, adrv9009 interface boards through the FPGA's FMC interface, applying ORIN to the AI+software-defined radio field.
4. Creating jesd204b interface boards via the FPGA's FMC interface, connecting advanced A/D and D/A chips. Conducting analog signal acquisition and intelligent processing, applied in distributed optical fiber signal processing.
5. Connecting 24bit high-precision A/D via the FPGA's FMC interface, used for IEPE vibration monitoring, applicable to large rotating equipment and wind turbine operation monitoring.
6. Robots, drones.
II. Board Architecture
The board adopts an ORIN+FPGA architecture. ORIN is an embedded chip designed by NVIDIA specifically for edge AI and robotics, manufactured using 7nm process technology, with a single chip computing power of up to 157TOPS, supporting multi-sensor parallel processing. Different models offer varying computing power and power consumption. Our board can be equipped with:
● ORIN NANO 4G module
● ORIN NANO 8G module
● ORIN NX 8G module
● ORIN NX 16G module
The FPGA uses Xilinx's Kintex UltraScale+ series XCKU5P-2FFVB676I or Xilinx Artix UltraScale+ XCAU15P-2FFVB676I, which are pin-compatible. The latter supports PCIe Gen4 at 16GT/s, enabling faster PCIe communication rates. (Refer to Figure 2 for the architecture diagram)
Board Introduction:
● ORIN side: DisplayPort display interface.
● ORIN side: 4X USB3.0 interfaces.
● ORIN side: RJ45 Gigabit Ethernet interface.
● ORIN side: USB Type-C interface.
● ORIN side: 1TB SSD solid-state drive, with read speeds of 3180MB/s and write speeds of 2960MB/s.
● ORIN side: 5G full-network module and WIFI module.
● FPGA side: 2GB DDR4-2600 memory.
● FPGA side: Dual QSPI flash MT25QU256###x.
● FPGA side: Single-ended 80MHz, differential 200MHz, and SI5328B-C-GMR clock.
● Onboard FMC interface, 10 lanes of GTY, and 54 pairs of LVDS.
● The board requires industrial-grade chips. The structure meets anti-vibration requirements.
Physical Characteristics:
● Operating temperature: ORIN module operates over a wide temperature range: -25°C ~ 70°C, other parts are industrial-grade: -40℃~+85℃.
● Operating humidity: 10%～80%.
● Power Supply Requirements:
● Single power supply, total board power consumption: 40W.
● Voltage: DC +12V, 5A.
● Ripple: ≤10%.
● Board size: 186mm x 115mm.
Reference Chassis:
To facilitate user convenience, we have customized chassis for customers, as shown below. There is also a smaller one that can meet the same requirements. During board design, we communicated with the manufacturer, ensuring the board size matches the chassis dimensions. Additionally, we can customize holes, install cooling fans, and fins according to user requirements.

26/01/2026

Signal Processing Board Based on ZYNQ Architecture
I. Overview
Our company possesses capabilities for the design, simulation, and test development of fully domestically produced data boards based on ZYNQ. The signal processing board based on the ZYNQ architecture is a board that operates under a real-time operating system. It is used in a certain flight system to control overall module management and external information data interaction, completing the digital intermediate frequency (IF) signal processing function.
This board consists of two signal processing paths. A single processing path forms the minimum ZYNQ system with one FMQL100T 900 PSOC chip, one EMMC chip, one QSPI FLASH chip, and two DDR3 chips.
Key Features:
• Supports LVDS serial communication with a transmission rate ranging
from 115200bps to 6.25Mbps;
• Supports GTX bus transmission rates configurable at 1.25Gbps, 2.5Gbps, 3.125Gbps, and 5Gbps;
• Supports LVDS data communication up to a maximum rate of 200Mbps;
• Built-in debugging serial port, Gigabit Ethernet port, and JTAG debug
cable;
• Supports external GM4526 and channel AD control.
II. Technical Specifications
• Model: FMQL100T900;
• Main frequency: 1GHz, configurable to 800MHz;
• DDR3: 1GB capacity, 32-bit width, DDR clock configuration
up to 800MHz;
• EMMC: Capacity not less than 8GBytes, write speed not
less than 2MBytes/s;
• Program boot memory: ZYNQ boots using QSPI Flash with
a capacity of not less than 16MByte;
• Maximum power consumption: 30W;
• Operating temperature range: -55℃ ~ +85℃;
• Component dimensions: 132mm90mm10mm;
• Component weight: 130g.
III. Application Fields
Used for general control and management in flight systems.

14/01/2026

Multi-channel frequency-hopping daughter card
I. Overview
The multi-channel frequency-agile subcard is centered around an FMQL45T900 SOC processor, paired with two 9361 chips and one 9009 chip to achieve multi-channel signal reception and transmission. The operating frequency range of the 9361 is from 70MHz to 6GHz, with an analog bandwidth ranging from 200KHz to 56MHz. The operating frequency range of the 9009 is from 75MHz to 6GHz, with a real-time transmit bandwidth of 450MHz and a receive bandwidth that can reach up to 200MHz.
Key Features:
● Provides external connectors for transparent data transmission via LVDS and GTX interfaces, facilitating secondary development;
● Two 9361 chips support four receive and four transmit channels, enabling inter-chip synchronization, with a maximum AD and DA sampling frequency of 61.44MHz;
● One 9009 chip supports one receive and one transmit channel, with a maximum transmit bandwidth of 450MHz and a receive bandwidth that can reach up to 200MHz;
● Internal and external clocks are configurable, with a precision higher than ±1 ppm;
● RF port anti-burnout level: ≥ 10dBm;
● Devices support multiple program versions, allowing for dynamic reconfiguration of system functions;
● Provides software version authentication functionality to prevent unauthorized reading or tampering of software.
II.Technical Specifications
● Model: FMQL45T900, Quad-core processor with a maximum operating frequency of 800MHz; PS DDR3: 1GB, QSPI FLASH: 256Mb, EMMC: 32GB
● 9361: Number of channels: 2T 2R, Frequency band: 70 MHz to 6.0 GHz, Supports TDD and FDD, Bandwidth: 200 kHz to 56 MHz, ADC and DAC bit width: 12bit, Data interface: LVDS
● 9009: Number of channels: 1T 1R, Maximum receiver bandwidth: 200 MHz, Maximum transmitter bandwidth: 450 MHz, Frequency band: 75 MHz to 6000 MHz, Data interface: JESD204B
● AD and DA sampling frequencies can be set
● Supports switching between internal and external clocks
● Maximum power consumption: 20W (powered by +5V)
● Operating temperature range: -55℃ ~ +85℃
● Dimensions: Customized structure, 150mm * 100mm * 2mm
Board weight: 150g
III. Application FieldsTelemetry and remote control, data link, satellite communication.